Jaesik Lee
About
Jaesik Lee has authored 56 papers that have received a total of 391 indexed citations.
This includes 19 papers in Electrical and Electronic Engineering, 11 papers in Oral Surgery and 6 papers in Molecular Biology. The topics of these papers are 3D IC and TSV technologies (8 papers), Electronic Packaging and Soldering Technologies (8 papers) and Innovation in Digital Healthcare Systems (5 papers). Jaesik Lee is often cited by papers focused on 3D IC and TSV technologies (8 papers), Electronic Packaging and Soldering Technologies (8 papers) and Innovation in Digital Healthcare Systems (5 papers) and collaborates with scholars based in South Korea, United States and Canada. Jaesik Lee's co-authors include A. Leven, Y. Baeyens, Young-Kai Chen, Soon‐Hyeun Nam and Ut-Va Koc and has published in prestigious journals such as PLoS ONE, IEEE Journal of Solid-State Circuits and Sustainability
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