Jan Řeboun
About
Jan Řeboun has authored 24 papers that have received a total of 164 indexed citations.
This includes 18 papers in Electrical and Electronic Engineering, 8 papers in Biomedical Engineering and 7 papers in Polymers and Plastics. The topics of these papers are Electronic Packaging and Soldering Technologies (7 papers), Advanced Sensor and Energy Harvesting Materials (7 papers) and 3D IC and TSV technologies (4 papers). Jan Řeboun is often cited by papers focused on Electronic Packaging and Soldering Technologies (7 papers), Advanced Sensor and Energy Harvesting Materials (7 papers) and 3D IC and TSV technologies (4 papers) and collaborates with scholars based in Czechia, Germany and Portugal. Jan Řeboun's co-authors include Aleš Hamáček, I. Ďuran, Radek Polanský, Sergii Pochekailov and Petr Kadlec and has published in prestigious journals such as Scripta Materialia, Applied Thermal Engineering and Materials
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