Jao-Hwa Kuang

54 papers and 625 indexed citations i.

Jao-Hwa Kuang has authored 54 papers that have received a total of 625 indexed citations. This includes 29 papers in Electrical and Electronic Engineering, 18 papers in Mechanical Engineering and 14 papers in Mechanics of Materials. The topics of these papers are Electronic Packaging and Soldering Technologies (12 papers), 3D IC and TSV technologies (8 papers) and Semiconductor Lasers and Optical Devices (8 papers). Jao-Hwa Kuang is often cited by papers focused on Electronic Packaging and Soldering Technologies (12 papers), 3D IC and TSV technologies (8 papers) and Semiconductor Lasers and Optical Devices (8 papers) and collaborates with scholars based in Taiwan and United States. Jao-Hwa Kuang's co-authors include Wood-Hi Cheng, Maw-Tyan Sheen, Bo-Wun Huang, Yung-Chuan Chen and Chao‐Jung Chen and has published in prestigious journals such as Journal of Applied Physics, Optics Letters and Journal of Applied Mechanics