Jay Im
About
Jay Im has authored 45 papers that have received a total of 1.2k indexed citations.
This includes 40 papers in Electrical and Electronic Engineering, 14 papers in Biomedical Engineering and 6 papers in Electronic, Optical and Magnetic Materials. The topics of these papers are 3D IC and TSV technologies (20 papers), Electronic Packaging and Soldering Technologies (15 papers) and Advancements in PLL and VCO Technologies (12 papers). Jay Im is often cited by papers focused on 3D IC and TSV technologies (20 papers), Electronic Packaging and Soldering Technologies (15 papers) and Advancements in PLL and VCO Technologies (12 papers) and collaborates with scholars based in United States, South Korea and Germany. Jay Im's co-authors include Paul S. Ho, Rui Huang, Parag Upadhyaya, Ken Chang and Yohan Frans and has published in prestigious journals such as Applied Physics Letters, Journal of Applied Physics and Acta Materialia
In The Last Decade
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