Jenq‐Gong Duh
About
Jenq‐Gong Duh has authored 399 papers that have received a total of 8.3k indexed citations.
This includes 240 papers in Electrical and Electronic Engineering, 182 papers in Mechanical Engineering and 139 papers in Materials Chemistry. The topics of these papers are Electronic Packaging and Soldering Technologies (117 papers), 3D IC and TSV technologies (93 papers) and Metal and Thin Film Mechanics (93 papers). Jenq‐Gong Duh is often cited by papers focused on Electronic Packaging and Soldering Technologies (117 papers), 3D IC and TSV technologies (93 papers) and Metal and Thin Film Mechanics (93 papers) and collaborates with scholars based in Taiwan, United States and China. Jenq‐Gong Duh's co-authors include Jyh‐Wei Lee, Hsien‐Wei Chen, Sien Chi, Shih-Kang Tien and Fan‐Bean Wu and has published in prestigious journals such as Applied Physics Letters, Journal of Applied Physics and Journal of The Electrochemical Society
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