J.F.J.M. Caers
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J.F.J.M. Caers has authored 24 papers that have received a total of 312 indexed citations.
This includes 23 papers in Electrical and Electronic Engineering, 10 papers in Mechanics of Materials and 7 papers in Mechanical Engineering. The topics of these papers are Electronic Packaging and Soldering Technologies (23 papers), 3D IC and TSV technologies (16 papers) and Mechanical Behavior of Composites (7 papers). J.F.J.M. Caers is often cited by papers focused on Electronic Packaging and Soldering Technologies (23 papers), 3D IC and TSV technologies (16 papers) and Mechanical Behavior of Composites (7 papers) and collaborates with scholars based in The Netherlands, United States and Singapore. J.F.J.M. Caers's co-authors include Xiujuan Zhao, E.H. Wong, W.D. van Driel, S.K.W. Seah and Y. S. Lai and has published in prestigious journals such as Materials Science and Engineering A, Materials Letters and International Journal of Fatigue
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