Jia-Hong Ke

28 papers and 483 indexed citations i.

Jia-Hong Ke has authored 28 papers that have received a total of 483 indexed citations. This includes 15 papers in Materials Chemistry, 13 papers in Mechanical Engineering and 10 papers in Electrical and Electronic Engineering. The topics of these papers are Nuclear Materials and Properties (9 papers), Electronic Packaging and Soldering Technologies (9 papers) and High Temperature Alloys and Creep (7 papers). Jia-Hong Ke is often cited by papers focused on Nuclear Materials and Properties (9 papers), Electronic Packaging and Soldering Technologies (9 papers) and High Temperature Alloys and Creep (7 papers) and collaborates with scholars based in United States, Taiwan and China. Jia-Hong Ke's co-authors include C. R. Kao, Tsung‐Lin Yang, Julie D. Tucker, Larry K. Aagesen and Wen Jiang and has published in prestigious journals such as Journal of Applied Physics, Acta Materialia and Journal of Alloys and Compounds