Jianxin Wang
About
Jianxin Wang has authored 80 papers that have received a total of 1.0k indexed citations.
This includes 46 papers in Mechanical Engineering, 34 papers in Electrical and Electronic Engineering and 14 papers in Aerospace Engineering. The topics of these papers are Electronic Packaging and Soldering Technologies (28 papers), 3D IC and TSV technologies (24 papers) and Advanced Welding Techniques Analysis (18 papers). Jianxin Wang is often cited by papers focused on Electronic Packaging and Soldering Technologies (28 papers), 3D IC and TSV technologies (24 papers) and Advanced Welding Techniques Analysis (18 papers) and collaborates with scholars based in China, United States and Japan. Jianxin Wang's co-authors include Songbai Xue, Chuan Liu, Chad M. Landis, YU Sheng-lin and Jianfei Wang and has published in prestigious journals such as Acta Materialia, Bioresource Technology and Scientific Reports
In The Last Decade
Explore authors with similar magnitude of impact
Top fields papers by Changxing Qi are about Top journals papers by A.K. Ganguly are published in Top fields papers by Mian Wang are about Top countries impacted by papers by Neri Alves Top countries impacted by papers by Violeta K. Voronkova Top authors papers by A. N. Prior are co-authored with Top journals papers by Georg Kähler are published in Top countries impacted by papers by S. Caenepeel