Jianyong Xie

13 papers and 219 indexed citations i.

Jianyong Xie has authored 13 papers that have received a total of 219 indexed citations. This includes 13 papers in Electrical and Electronic Engineering, 2 papers in Atomic and Molecular Physics, and Optics and 1 paper in Mechanical Engineering. The topics of these papers are 3D IC and TSV technologies (7 papers), Electromagnetic Compatibility and Noise Suppression (5 papers) and Electronic Packaging and Soldering Technologies (5 papers). Jianyong Xie is often cited by papers focused on 3D IC and TSV technologies (7 papers), Electromagnetic Compatibility and Noise Suppression (5 papers) and Electronic Packaging and Soldering Technologies (5 papers) and collaborates with scholars based in United States, China and Singapore. Jianyong Xie's co-authors include Madhavan Swaminathan, Daehyun Chung, Wen‐Yan Yin, Kai Kang and Junfa Mao and has published in prestigious journals such as IEEE Transactions on Microwave Theory and Techniques, IEEE Microwave and Wireless Components Letters and IEEE Transactions on Electromagnetic Compatibility.