Jiayun Feng
About
Jiayun Feng has authored 43 papers that have received a total of 779 indexed citations.
This includes 31 papers in Electrical and Electronic Engineering, 17 papers in Mechanical Engineering and 15 papers in Biomedical Engineering. The topics of these papers are Electronic Packaging and Soldering Technologies (17 papers), Advanced Sensor and Energy Harvesting Materials (12 papers) and 3D IC and TSV technologies (11 papers). Jiayun Feng is often cited by papers focused on Electronic Packaging and Soldering Technologies (17 papers), Advanced Sensor and Energy Harvesting Materials (12 papers) and 3D IC and TSV technologies (11 papers) and collaborates with scholars based in China, Canada and Singapore. Jiayun Feng's co-authors include Yanhong Tian, Y. Zhou, Shang Wang, Ming Xiao and He Zhang and has published in prestigious journals such as Advanced Materials, Journal of Applied Physics and Scientific Reports
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