Jihperng Leu
About
Jihperng Leu has authored 72 papers that have received a total of 1.1k indexed citations.
This includes 39 papers in Electronic, Optical and Magnetic Materials, 37 papers in Electrical and Electronic Engineering and 34 papers in Materials Chemistry. The topics of these papers are Copper Interconnects and Reliability (32 papers), Semiconductor materials and devices (22 papers) and Metal and Thin Film Mechanics (19 papers). Jihperng Leu is often cited by papers focused on Copper Interconnects and Reliability (32 papers), Semiconductor materials and devices (22 papers) and Metal and Thin Film Mechanics (19 papers) and collaborates with scholars based in Taiwan, United States and China. Jihperng Leu's co-authors include Chih‐Wei Luo, Paul S. Ho, Phuoc Huu Le, Yu‐Min Chang and Yi-Lung Cheng and has published in prestigious journals such as Applied Physics Letters, Journal of Applied Physics and Journal of The Electrochemical Society
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