Jihun Jang
About
Jihun Jang has authored 16 papers that have received a total of 741 indexed citations.
This includes 9 papers in Electrical and Electronic Engineering, 7 papers in Mechanical Engineering and 5 papers in Biomedical Engineering. The topics of these papers are Electronic Packaging and Soldering Technologies (8 papers), Photoacoustic and Ultrasonic Imaging (5 papers) and 3D IC and TSV technologies (5 papers). Jihun Jang is often cited by papers focused on Electronic Packaging and Soldering Technologies (8 papers), Photoacoustic and Ultrasonic Imaging (5 papers) and 3D IC and TSV technologies (5 papers) and collaborates with scholars based in United States, South Korea and Italy. Jihun Jang's co-authors include D. R. Frear, Jin Ho Chang, K. N. Tu, J. K. Lin and Yangmo Yoo and has published in prestigious journals such as Journal of Applied Physics, International Journal of Radiation Oncology*Biology*Physics and IEEE Transactions on Biomedical Engineering
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