Jingdong Guo

112 papers and 1.9k indexed citations i.

Jingdong Guo has authored 112 papers that have received a total of 1.9k indexed citations. This includes 82 papers in Electrical and Electronic Engineering, 47 papers in Materials Chemistry and 28 papers in Mechanical Engineering. The topics of these papers are Electronic Packaging and Soldering Technologies (32 papers), Electromagnetic Effects on Materials (22 papers) and 3D IC and TSV technologies (13 papers). Jingdong Guo is often cited by papers focused on Electronic Packaging and Soldering Technologies (32 papers), Electromagnetic Effects on Materials (22 papers) and 3D IC and TSV technologies (13 papers) and collaborates with scholars based in China, United States and Germany. Jingdong Guo's co-authors include De’an Yang, Zhiyuan Sang, Guanhu He, Yizhou Zhou and Gaohang He and has published in prestigious journals such as Nature Communications, Applied Physics Letters and Journal of Applied Physics