Jin‐Wook Jang
About
Jin‐Wook Jang has authored 34 papers that have received a total of 671 indexed citations.
This includes 16 papers in Electrical and Electronic Engineering, 9 papers in Materials Chemistry and 8 papers in Mechanical Engineering. The topics of these papers are Electronic Packaging and Soldering Technologies (11 papers), 3D IC and TSV technologies (10 papers) and Intermetallics and Advanced Alloy Properties (5 papers). Jin‐Wook Jang is often cited by papers focused on Electronic Packaging and Soldering Technologies (11 papers), 3D IC and TSV technologies (10 papers) and Intermetallics and Advanced Alloy Properties (5 papers) and collaborates with scholars based in South Korea, United States and India. Jin‐Wook Jang's co-authors include D. R. Frear, Jong‐Kai Lin, Chang‐Hoon Han, Yong Jin and A. Rineiski and has published in prestigious journals such as Applied Physics Letters, Journal of Applied Physics and Journal of Agricultural and Food Chemistry
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