Jiwoo Pak

8 papers and 245 indexed citations i.

Jiwoo Pak has authored 8 papers that have received a total of 245 indexed citations. This includes 8 papers in Electrical and Electronic Engineering, 4 papers in Electronic, Optical and Magnetic Materials and 2 papers in Hardware and Architecture. The topics of these papers are 3D IC and TSV technologies (6 papers), Electronic Packaging and Soldering Technologies (4 papers) and Copper Interconnects and Reliability (4 papers). Jiwoo Pak is often cited by papers focused on 3D IC and TSV technologies (6 papers), Electronic Packaging and Soldering Technologies (4 papers) and Copper Interconnects and Reliability (4 papers) and collaborates with scholars based in United States. Jiwoo Pak's co-authors include Sung Kyu Lim, David Z. Pan, Jae-Seok Yang and Quoc V. Le and has published in prestigious journals such as Nature and IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems