J.K.L. Lai

187 papers and 5.6k indexed citations i.

J.K.L. Lai has authored 187 papers that have received a total of 5.6k indexed citations. This includes 97 papers in Materials Chemistry, 89 papers in Mechanical Engineering and 71 papers in Electrical and Electronic Engineering. The topics of these papers are Electronic Packaging and Soldering Technologies (33 papers), Gas Sensing Nanomaterials and Sensors (31 papers) and Microstructure and Mechanical Properties of Steels (30 papers). J.K.L. Lai is often cited by papers focused on Electronic Packaging and Soldering Technologies (33 papers), Gas Sensing Nanomaterials and Sensors (31 papers) and Microstructure and Mechanical Properties of Steels (30 papers) and collaborates with scholars based in Hong Kong, China and United Kingdom. J.K.L. Lai's co-authors include C.H. Shek, Chi‐Man Lawrence Wu, Minghong Wu, Zheng Jiao and G.M. Lin and has published in prestigious journals such as Chemical Reviews, The Journal of Chemical Physics and ACS Nano