Joeri De Vos
About
Joeri De Vos has authored 40 papers that have received a total of 177 indexed citations.
This includes 39 papers in Electrical and Electronic Engineering, 8 papers in Biomedical Engineering and 5 papers in Electronic, Optical and Magnetic Materials. The topics of these papers are 3D IC and TSV technologies (21 papers), Electronic Packaging and Soldering Technologies (12 papers) and Semiconductor materials and devices (12 papers). Joeri De Vos is often cited by papers focused on 3D IC and TSV technologies (21 papers), Electronic Packaging and Soldering Technologies (12 papers) and Semiconductor materials and devices (12 papers) and collaborates with scholars based in Belgium, The Netherlands and Japan. Joeri De Vos's co-authors include Eric Beyne, J. Van Houdt, B. Govoreanu, Andy Miller and Ingrid De Wolf and has published in prestigious journals such as Applied Surface Science, IEEE Transactions on Electron Devices and Japanese Journal of Applied Physics
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