Johannes Etzkorn
About
Johannes Etzkorn has authored 22 papers that have received a total of 501 indexed citations.
This includes 12 papers in Materials Chemistry, 8 papers in Electrical and Electronic Engineering and 7 papers in Mechanical Engineering. The topics of these papers are MXene and MAX Phase Materials (7 papers), Copper Interconnects and Reliability (5 papers) and Electronic Packaging and Soldering Technologies (4 papers). Johannes Etzkorn is often cited by papers focused on MXene and MAX Phase Materials (7 papers), Copper Interconnects and Reliability (5 papers) and Electronic Packaging and Soldering Technologies (4 papers) and collaborates with scholars based in Germany, Portugal and Jordan. Johannes Etzkorn's co-authors include Harald Hillebrecht, Martin Ade, Carlos J. Tavares, Qais M. Al‐Bataineh and Constantin Vahlas and has published in prestigious journals such as Advanced Materials, Journal of The Electrochemical Society and Inorganic Chemistry
In The Last Decade
Explore authors with similar magnitude of impact
Top authors papers by Amitesh Anand are co-authored with Top countries impacted by papers by M. M. Lubani Top countries impacted by papers by Isaac Torres‐Díaz Top authors papers by R. Carabias Martínez are co-authored with Top authors papers by A. Riva are co-authored with Top journals papers by Narasimhan Loganathan are published in Top fields papers by L. Zhang are about Top fields papers by Barry Trager are about