John Dukovic
About
John Dukovic has authored 17 papers that have received a total of 1.5k indexed citations.
This includes 16 papers in Electrical and Electronic Engineering, 6 papers in Materials Chemistry and 5 papers in Electronic, Optical and Magnetic Materials. The topics of these papers are Electrodeposition and Electroless Coatings (10 papers), Electronic Packaging and Soldering Technologies (5 papers) and Copper Interconnects and Reliability (5 papers). John Dukovic is often cited by papers focused on Electrodeposition and Electroless Coatings (10 papers), Electronic Packaging and Soldering Technologies (5 papers) and Copper Interconnects and Reliability (5 papers) and collaborates with scholars based in United States and Germany. John Dukovic's co-authors include P. C. Andricacos, L. T. Romankiw, S. Mehdizadeh, H. Y. Cheh and Charles W. Tobias and has published in prestigious journals such as Journal of The Electrochemical Society, IBM Journal of Research and Development and IEEE Transactions on Device and Materials Reliability
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