John Parry

10 papers and 196 indexed citations i.

John Parry has authored 10 papers that have received a total of 196 indexed citations. This includes 7 papers in Electrical and Electronic Engineering, 6 papers in Mechanical Engineering and 4 papers in Materials Chemistry. The topics of these papers are Electronic Packaging and Soldering Technologies (6 papers), Heat Transfer and Optimization (5 papers) and Thermal properties of materials (4 papers). John Parry is often cited by papers focused on Electronic Packaging and Soldering Technologies (6 papers), Heat Transfer and Optimization (5 papers) and Thermal properties of materials (4 papers) and collaborates with scholars based in Finland, United States and United Kingdom. John Parry's co-authors include Clemens Lasance, H.I. Rosten, Jukka Rantala, Robin Bornoff and Helen Reeves and has published in prestigious journals such as SAE technical papers on CD-ROM/SAE technical paper series, Microelectronics Reliability and IEEE Transactions on Components and Packaging Technologies