John S. Chun
About
John S. Chun has authored 49 papers that have received a total of 1.0k indexed citations.
This includes 27 papers in Electrical and Electronic Engineering, 24 papers in Mechanics of Materials and 22 papers in Materials Chemistry. The topics of these papers are Metal and Thin Film Mechanics (24 papers), Semiconductor materials and devices (18 papers) and Copper Interconnects and Reliability (14 papers). John S. Chun is often cited by papers focused on Metal and Thin Film Mechanics (24 papers), Semiconductor materials and devices (18 papers) and Copper Interconnects and Reliability (14 papers) and collaborates with scholars based in South Korea and United States. John S. Chun's co-authors include Il Kim, Won-Jong Lee, Chi‐Wan Lee, Sang‐Won Kang and S.W. Nam and has published in prestigious journals such as Applied Physics Letters, Chemistry of Materials and Journal of the American Ceramic Society
In The Last Decade
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