John S. Chun
About
John S. Chun has authored 49 papers that have received a total of 1.0k indexed citations.
This includes 27 papers in Electrical and Electronic Engineering, 24 papers in Mechanics of Materials and 22 papers in Materials Chemistry. The topics of these papers are Metal and Thin Film Mechanics (24 papers), Semiconductor materials and devices (18 papers) and Copper Interconnects and Reliability (14 papers). John S. Chun is often cited by papers focused on Metal and Thin Film Mechanics (24 papers), Semiconductor materials and devices (18 papers) and Copper Interconnects and Reliability (14 papers) and collaborates with scholars based in South Korea and United States. John S. Chun's co-authors include Il Kim, Won-Jong Lee, Chi‐Wan Lee, Sang‐Won Kang and S.W. Nam and has published in prestigious journals such as Applied Physics Letters, Chemistry of Materials and Journal of the American Ceramic Society
In The Last Decade
Explore authors with similar magnitude of impact
Top fields papers by Philippe Chaumont are about Top authors papers by Hyeon‐Joong Kim are co-authored with Top authors papers by S. M. Garnsey are co-authored with Top fields papers by M. Cecilia Gonzalez Corcia are about Top authors papers by Jun Hou are co-authored with Top fields papers by Jean‐Jacques Sauvain are about Top journals papers by Doris Heinrich are published in Top fields papers by Adam Robinson are about