Jongmyung Kim

35 papers and 397 indexed citations i.

Jongmyung Kim has authored 35 papers that have received a total of 397 indexed citations. This includes 15 papers in Electrical and Electronic Engineering, 11 papers in Mechanical Engineering and 8 papers in Aerospace Engineering. The topics of these papers are Electronic Packaging and Soldering Technologies (11 papers), 3D IC and TSV technologies (7 papers) and Aluminum Alloy Microstructure Properties (7 papers). Jongmyung Kim is often cited by papers focused on Electronic Packaging and Soldering Technologies (11 papers), 3D IC and TSV technologies (7 papers) and Aluminum Alloy Microstructure Properties (7 papers) and collaborates with scholars based in China, South Korea and Hong Kong. Jongmyung Kim's co-authors include Mingyu Li, Ming Yang, Hongjun Ji, Hongbo Xü and Ling Wang and has published in prestigious journals such as Journal of Applied Physics, Materials Science and Engineering A and Journal of Materials Science