Junxiang Jiang
About
Junxiang Jiang has authored 16 papers that have received a total of 380 indexed citations.
This includes 8 papers in Electrical and Electronic Engineering, 7 papers in Mechanical Engineering and 5 papers in Renewable Energy, Sustainability and the Environment. The topics of these papers are Electronic Packaging and Soldering Technologies (5 papers), Advanced Photocatalysis Techniques (4 papers) and 3D IC and TSV technologies (3 papers). Junxiang Jiang is often cited by papers focused on Electronic Packaging and Soldering Technologies (5 papers), Advanced Photocatalysis Techniques (4 papers) and 3D IC and TSV technologies (3 papers) and collaborates with scholars based in China, Japan and Taiwan. Junxiang Jiang's co-authors include Katsuaki Suganuma, Keun‐Soo Kim, Qianqian Zhang, Xin‐Yao Yu and Hao Bin Wu and has published in prestigious journals such as Chemical Engineering Journal, Journal of Colloid and Interface Science and Journal of Alloys and Compounds
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