Jun‐Yeob Song
About
Jun‐Yeob Song has authored 22 papers that have received a total of 375 indexed citations.
This includes 12 papers in Electrical and Electronic Engineering, 7 papers in Mechanical Engineering and 4 papers in Atomic and Molecular Physics, and Optics. The topics of these papers are 3D IC and TSV technologies (6 papers), Photopolymerization techniques and applications (4 papers) and Additive Manufacturing and 3D Printing Technologies (4 papers). Jun‐Yeob Song is often cited by papers focused on 3D IC and TSV technologies (6 papers), Photopolymerization techniques and applications (4 papers) and Additive Manufacturing and 3D Printing Technologies (4 papers) and collaborates with scholars based in South Korea and United States. Jun‐Yeob Song's co-authors include Jae‐Hak Lee, Ji‐Won Park, Seung‐Woo Lee, Hyun‐Joong Kim and Cho-Hee Park and has published in prestigious journals such as Thin Solid Films, Journal of Applied Polymer Science and Journal of Micromechanics and Microengineering
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