K. N. Tu
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K. N. Tu has authored 11 papers that have received a total of 694 indexed citations.
This includes 11 papers in Electrical and Electronic Engineering, 7 papers in Electronic, Optical and Magnetic Materials and 2 papers in Mechanical Engineering. The topics of these papers are Electronic Packaging and Soldering Technologies (10 papers), Copper Interconnects and Reliability (7 papers) and 3D IC and TSV technologies (6 papers). K. N. Tu is often cited by papers focused on Electronic Packaging and Soldering Technologies (10 papers), Copper Interconnects and Reliability (7 papers) and 3D IC and TSV technologies (6 papers) and collaborates with scholars based in United States, Italy and Singapore. K. N. Tu's co-authors include Subodh G. Mhaisalkar, Andriy Gusak, Ehrenfried Zschech, A. V. Vairagar and Chih Chen and has published in prestigious journals such as Applied Physics Letters, Journal of Applied Physics and Journal of materials research/Pratt's guide to venture capital sources
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