K. P. Rodbell
About
K. P. Rodbell has authored 29 papers that have received a total of 859 indexed citations.
This includes 28 papers in Electronic, Optical and Magnetic Materials, 20 papers in Electrical and Electronic Engineering and 9 papers in Mechanics of Materials. The topics of these papers are Copper Interconnects and Reliability (28 papers), Semiconductor materials and devices (14 papers) and Metal and Thin Film Mechanics (8 papers). K. P. Rodbell is often cited by papers focused on Copper Interconnects and Reliability (28 papers), Semiconductor materials and devices (14 papers) and Metal and Thin Film Mechanics (8 papers) and collaborates with scholars based in United States, Italy and Canada. K. P. Rodbell's co-authors include E. G. Colgan, J. M. E. Harper, C. Cabral, Conal E. Murray and L. Gignac and has published in prestigious journals such as Applied Physics Letters, Journal of Applied Physics and Thin Solid Films
In The Last Decade
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