Kai Zoschke
About
Kai Zoschke has authored 26 papers that have received a total of 175 indexed citations.
This includes 25 papers in Electrical and Electronic Engineering, 9 papers in Biomedical Engineering and 6 papers in Nuclear and High Energy Physics. The topics of these papers are 3D IC and TSV technologies (17 papers), Electronic Packaging and Soldering Technologies (9 papers) and Particle Detector Development and Performance (6 papers). Kai Zoschke is often cited by papers focused on 3D IC and TSV technologies (17 papers), Electronic Packaging and Soldering Technologies (9 papers) and Particle Detector Development and Performance (6 papers) and collaborates with scholars based in Germany, Finland and Switzerland. Kai Zoschke's co-authors include T. Fritzsch, O. Ehrmann, Hermann Oppermann, Martin Wilke and H. Reichl and has published in prestigious journals such as IEEE Journal of Solid-State Circuits, Sensors and Actuators A Physical and Nuclear Instruments and Methods in Physics Research Section A Accelerators Spectrometers Detectors and Associated Equipment
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