Kanji Ōtsuka
About
Kanji Ōtsuka has authored 21 papers that have received a total of 220 indexed citations.
This includes 8 papers in Electrical and Electronic Engineering, 4 papers in Mechanical Engineering and 4 papers in Ceramics and Composites. The topics of these papers are 3D IC and TSV technologies (4 papers), Advanced ceramic materials synthesis (4 papers) and Electronic Packaging and Soldering Technologies (3 papers). Kanji Ōtsuka is often cited by papers focused on 3D IC and TSV technologies (4 papers), Advanced ceramic materials synthesis (4 papers) and Electronic Packaging and Soldering Technologies (3 papers) and collaborates with scholars based in Japan, United Kingdom and United States. Kanji Ōtsuka's co-authors include Katsuaki Suganuma, Masaya Nogi, Natsuki Komoda, Keiichi Inoue and Noriyuki Murakami and has published in prestigious journals such as Nanoscale, Journal of the American Ceramic Society and Journal of the Japan Institute of Metals and Materials
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