Katsuyuki Sakuma
About
Katsuyuki Sakuma has authored 31 papers that have received a total of 638 indexed citations.
This includes 24 papers in Electrical and Electronic Engineering, 11 papers in Biomedical Engineering and 5 papers in Automotive Engineering. The topics of these papers are 3D IC and TSV technologies (21 papers), Electronic Packaging and Soldering Technologies (17 papers) and Nanofabrication and Lithography Techniques (6 papers). Katsuyuki Sakuma is often cited by papers focused on 3D IC and TSV technologies (21 papers), Electronic Packaging and Soldering Technologies (17 papers) and Nanofabrication and Lithography Techniques (6 papers) and collaborates with scholars based in Japan, United States and Canada. Katsuyuki Sakuma's co-authors include Shuichi Shoji, Jun Mizuno, John Knickerbocker, Mitsumasa Koyanagi and N. Miyakawa and has published in prestigious journals such as Scientific Reports, IEEE Access and Japanese Journal of Applied Physics
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