K.C. Hung
About
K.C. Hung has authored 71 papers that have received a total of 1.0k indexed citations.
This includes 23 papers in Electrical and Electronic Engineering, 22 papers in Condensed Matter Physics and 14 papers in Biomedical Engineering. The topics of these papers are Physics of Superconductivity and Magnetism (21 papers), Electronic Packaging and Soldering Technologies (18 papers) and 3D IC and TSV technologies (15 papers). K.C. Hung is often cited by papers focused on Physics of Superconductivity and Magnetism (21 papers), Electronic Packaging and Soldering Technologies (18 papers) and 3D IC and TSV technologies (15 papers) and collaborates with scholars based in Hong Kong, China and Taiwan. K.C. Hung's co-authors include Y.C. Chan, Y.C. Chan, P.L. Tu, C.C. Lam and Chengcheng Tang and has published in prestigious journals such as Proceedings of the National Academy of Sciences, Applied Physics Letters and Analytical Chemistry
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