Kei Murayama
About
Kei Murayama has authored 18 papers that have received a total of 123 indexed citations.
This includes 11 papers in Electrical and Electronic Engineering, 6 papers in Computational Mechanics and 3 papers in Aerospace Engineering. The topics of these papers are 3D IC and TSV technologies (10 papers), Electronic Packaging and Soldering Technologies (9 papers) and Fluid Dynamics and Heat Transfer (4 papers). Kei Murayama is often cited by papers focused on 3D IC and TSV technologies (10 papers), Electronic Packaging and Soldering Technologies (9 papers) and Fluid Dynamics and Heat Transfer (4 papers) and collaborates with scholars based in Japan, United States and South Korea. Kei Murayama's co-authors include Seoksu Moon, Toshiyuki Arima, Weidi Huang and Mitsutoshi Higashi and has published in prestigious journals such as International Journal of Heat and Mass Transfer, Fuel and Journal of Wind Engineering and Industrial Aerodynamics
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