Keisuke Uenishi
About
Keisuke Uenishi has authored 44 papers that have received a total of 442 indexed citations.
This includes 33 papers in Mechanical Engineering, 18 papers in Electrical and Electronic Engineering and 9 papers in Materials Chemistry. The topics of these papers are Electronic Packaging and Soldering Technologies (16 papers), 3D IC and TSV technologies (15 papers) and Intermetallics and Advanced Alloy Properties (15 papers). Keisuke Uenishi is often cited by papers focused on Electronic Packaging and Soldering Technologies (16 papers), 3D IC and TSV technologies (15 papers) and Intermetallics and Advanced Alloy Properties (15 papers) and collaborates with scholars based in Japan, United States and France. Keisuke Uenishi's co-authors include Kojiro F. Kobayashi, Masaharu Yamamoto, Masanori Seki, Paul Hideo Shingu and Keiichi N. Ishihara and has published in prestigious journals such as Materials Science and Engineering A, Journal of Materials Science and Sensors
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