Kejun Zeng
About
Kejun Zeng has authored 30 papers that have received a total of 976 indexed citations.
This includes 17 papers in Mechanical Engineering, 13 papers in Electrical and Electronic Engineering and 6 papers in Atomic and Molecular Physics, and Optics. The topics of these papers are Electronic Packaging and Soldering Technologies (8 papers), 3D IC and TSV technologies (7 papers) and Intermetallics and Advanced Alloy Properties (7 papers). Kejun Zeng is often cited by papers focused on Electronic Packaging and Soldering Technologies (8 papers), 3D IC and TSV technologies (7 papers) and Intermetallics and Advanced Alloy Properties (7 papers) and collaborates with scholars based in China, United States and Finland. Kejun Zeng's co-authors include J.K. Kivilahti, Tomi Laurila, I. Suni, Jyrki Molarius and R.J. Stierman and has published in prestigious journals such as Applied Physics Letters, Journal of Applied Physics and Energy and Buildings
In The Last Decade
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