Ken Gilleo
About
Ken Gilleo has authored 10 papers that have received a total of 95 indexed citations.
This includes 9 papers in Electrical and Electronic Engineering, 2 papers in Biomedical Engineering and 1 paper in Mechanics of Materials. The topics of these papers are 3D IC and TSV technologies (6 papers), Electronic Packaging and Soldering Technologies (5 papers) and Advanced MEMS and NEMS Technologies (2 papers). Ken Gilleo is often cited by papers focused on 3D IC and TSV technologies (6 papers), Electronic Packaging and Soldering Technologies (5 papers) and Advanced MEMS and NEMS Technologies (2 papers) and collaborates with scholars based in United States. Ken Gilleo's co-authors include Matthew J. Witt and has published in prestigious journals such as IEEE Transactions on Components and Packaging Technologies, Soldering and Surface Mount Technology and Circuit World
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