Kim S. Siow
About
Kim S. Siow has authored 65 papers that have received a total of 2.4k indexed citations.
This includes 33 papers in Electrical and Electronic Engineering, 16 papers in Mechanical Engineering and 14 papers in Biomedical Engineering. The topics of these papers are Electronic Packaging and Soldering Technologies (22 papers), 3D IC and TSV technologies (12 papers) and Surface Modification and Superhydrophobicity (12 papers). Kim S. Siow is often cited by papers focused on Electronic Packaging and Soldering Technologies (22 papers), 3D IC and TSV technologies (12 papers) and Surface Modification and Superhydrophobicity (12 papers) and collaborates with scholars based in Malaysia, Singapore and China. Kim S. Siow's co-authors include M. F. Mohd Razip Wee, Hans J. Griesser, Saravana Kumar, Leanne Britcher and Burhanuddin Yeop Majlis and has published in prestigious journals such as Scientific Reports, Materials Science and Engineering A and Journal of Physics D Applied Physics
In The Last Decade
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