Kuang‐Kuo Wang
About
Kuang‐Kuo Wang has authored 39 papers that have received a total of 423 indexed citations.
This includes 24 papers in Materials Chemistry, 19 papers in Electrical and Electronic Engineering and 11 papers in Mechanical Engineering. The topics of these papers are Advanced Thermoelectric Materials and Devices (13 papers), Chalcogenide Semiconductor Thin Films (10 papers) and Electronic Packaging and Soldering Technologies (7 papers). Kuang‐Kuo Wang is often cited by papers focused on Advanced Thermoelectric Materials and Devices (13 papers), Chalcogenide Semiconductor Thin Films (10 papers) and Electronic Packaging and Soldering Technologies (7 papers) and collaborates with scholars based in Taiwan, Hong Kong and United States. Kuang‐Kuo Wang's co-authors include Dershin Gan, Hsin‐Jay Wu, Liuwen Chang, Shih‐Fu Ou and Ker‐Chang Hsieh and has published in prestigious journals such as Advanced Materials, Advanced Functional Materials and Journal of The Electrochemical Society
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