Kuan-Hsun Lu

6 papers and 311 indexed citations i.

Kuan-Hsun Lu has authored 6 papers that have received a total of 311 indexed citations. This includes 6 papers in Electrical and Electronic Engineering, 2 papers in Biomedical Engineering and 2 papers in Mechanical Engineering. The topics of these papers are Electronic Packaging and Soldering Technologies (5 papers), 3D IC and TSV technologies (4 papers) and Intermetallics and Advanced Alloy Properties (2 papers). Kuan-Hsun Lu is often cited by papers focused on Electronic Packaging and Soldering Technologies (5 papers), 3D IC and TSV technologies (4 papers) and Intermetallics and Advanced Alloy Properties (2 papers) and collaborates with scholars based in United States and Taiwan. Kuan-Hsun Lu's co-authors include Paul S. Ho, Xuefeng Zhang, Suk-Kyu Ryu, Min Ding and Jay Im and has published in prestigious journals such as Journal of Applied Physics, Journal of Materials Science Materials in Electronics and IEEE Transactions on Device and Materials Reliability