Kun Hu
About
Kun Hu has authored 32 papers that have received a total of 549 indexed citations.
This includes 11 papers in Electrical and Electronic Engineering, 11 papers in Materials Chemistry and 9 papers in Mechanics of Materials. The topics of these papers are Metal and Thin Film Mechanics (9 papers), Copper Interconnects and Reliability (8 papers) and Microstructure and mechanical properties (6 papers). Kun Hu is often cited by papers focused on Metal and Thin Film Mechanics (9 papers), Copper Interconnects and Reliability (8 papers) and Microstructure and mechanical properties (6 papers) and collaborates with scholars based in China, Australia and Hong Kong. Kun Hu's co-authors include Xiangkang Meng, Zhenhua Cao, Xingyou Tian, Lin Wang and Kang Zheng and has published in prestigious journals such as Applied Physics Letters, Journal of Applied Physics and Macromolecules
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