Kun-Ling Wu
About
Kun-Ling Wu has authored 13 papers that have received a total of 429 indexed citations.
This includes 12 papers in Mechanical Engineering, 11 papers in Biomedical Engineering and 10 papers in Electrical and Electronic Engineering. The topics of these papers are Chemical Mechanical Polishing in Microelectronics Manufacturing (11 papers), Advanced machining processes and optimization (11 papers) and Advanced Machining and Optimization Techniques (10 papers). Kun-Ling Wu is often cited by papers focused on Chemical Mechanical Polishing in Microelectronics Manufacturing (11 papers), Advanced machining processes and optimization (11 papers) and Advanced Machining and Optimization Techniques (10 papers) and collaborates with scholars based in Taiwan and United States. Kun-Ling Wu's co-authors include Biing-Hwa Yan, Jyh‐Wei Lee, Jung-Chou Hung, Jui‐Che Lin and Yiin‐Kuen Fuh and has published in prestigious journals such as International Journal of Machine Tools and Manufacture, The International Journal of Advanced Manufacturing Technology and Journal of Micromechanics and Microengineering
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