Kwang-Yoo Byun
About
Kwang-Yoo Byun has authored 7 papers that have received a total of 447 indexed citations.
This includes 7 papers in Electrical and Electronic Engineering, 1 paper in Biomedical Engineering and 1 paper in Civil and Structural Engineering. The topics of these papers are 3D IC and TSV technologies (7 papers), Electronic Packaging and Soldering Technologies (4 papers) and Semiconductor materials and devices (2 papers). Kwang-Yoo Byun is often cited by papers focused on 3D IC and TSV technologies (7 papers), Electronic Packaging and Soldering Technologies (4 papers) and Semiconductor materials and devices (2 papers) and collaborates with scholars based in United States and South Korea. Kwang-Yoo Byun's co-authors include Min-Suk Suh, Joohee Kim, Taigon Song, Eakhwan Song and Kunwoo Park and has published in prestigious journals such as Applied Physics Letters, Journal of Electronic Materials and IEEE Transactions on Components Packaging and Manufacturing Technology
In The Last Decade
Explore authors with similar magnitude of impact
Top authors papers by Neelanjan Ray are co-authored with Top fields papers by Asghar Dolatkhah are about Top fields papers by Rajib Islam are about Top authors papers by Anusha Bishayee are co-authored with Top fields papers by Zachary Thomson are about Top journals papers by A. Plassais are published in Top authors papers by Bryan M. Lewis are co-authored with Top journals papers by Tadashi Nagaie are published in