L. Gignac
About
L. Gignac has authored 35 papers that have received a total of 656 indexed citations.
This includes 23 papers in Electrical and Electronic Engineering, 23 papers in Electronic, Optical and Magnetic Materials and 10 papers in Materials Chemistry. The topics of these papers are Copper Interconnects and Reliability (23 papers), Semiconductor materials and devices (17 papers) and Electronic Packaging and Soldering Technologies (9 papers). L. Gignac is often cited by papers focused on Copper Interconnects and Reliability (23 papers), Semiconductor materials and devices (17 papers) and Electronic Packaging and Soldering Technologies (9 papers) and collaborates with scholars based in United States and Taiwan. L. Gignac's co-authors include C.‐K. Hu, R. Rosenberg, A. Simon, Kenneth P. Rodbell and E. Liniger and has published in prestigious journals such as Nature, Applied Physics Letters and Journal of Applied Physics
In The Last Decade
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