Le Luo
About
Le Luo has authored 91 papers that have received a total of 644 indexed citations.
This includes 60 papers in Electrical and Electronic Engineering, 15 papers in Mechanical Engineering and 14 papers in Biomedical Engineering. The topics of these papers are 3D IC and TSV technologies (37 papers), Electronic Packaging and Soldering Technologies (33 papers) and Radio Frequency Integrated Circuit Design (7 papers). Le Luo is often cited by papers focused on 3D IC and TSV technologies (37 papers), Electronic Packaging and Soldering Technologies (33 papers) and Radio Frequency Integrated Circuit Design (7 papers) and collaborates with scholars based in China, Germany and Hong Kong. Le Luo's co-authors include Gaowei Xu, Weidong Xiang, Weidong Huang, Gong Cheng and Xiaoyun Ding and has published in prestigious journals such as Journal of Clinical Oncology, Blood and Scientific Reports
In The Last Decade
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