Lei Han
About
Lei Han has authored 41 papers that have received a total of 651 indexed citations.
This includes 19 papers in Electrical and Electronic Engineering, 12 papers in Mechanical Engineering and 12 papers in Mechanics of Materials. The topics of these papers are Electronic Packaging and Soldering Technologies (14 papers), 3D IC and TSV technologies (8 papers) and Adhesion, Friction, and Surface Interactions (6 papers). Lei Han is often cited by papers focused on Electronic Packaging and Soldering Technologies (14 papers), 3D IC and TSV technologies (8 papers) and Adhesion, Friction, and Surface Interactions (6 papers) and collaborates with scholars based in China, Hong Kong and United States. Lei Han's co-authors include Jue Zhong, Fuliang Wang, Junhui Li, Yu Zhang and Zhili Long and has published in prestigious journals such as Journal of Physics D Applied Physics, Sensors and IEEE Access
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