Lin Qu
About
Lin Qu has authored 31 papers that have received a total of 510 indexed citations.
This includes 13 papers in Electrical and Electronic Engineering, 11 papers in Mechanical Engineering and 8 papers in Aerospace Engineering. The topics of these papers are Electronic Packaging and Soldering Technologies (7 papers), Intermetallics and Advanced Alloy Properties (5 papers) and 3D IC and TSV technologies (4 papers). Lin Qu is often cited by papers focused on Electronic Packaging and Soldering Technologies (7 papers), Intermetallics and Advanced Alloy Properties (5 papers) and 3D IC and TSV technologies (4 papers) and collaborates with scholars based in China, Ethiopia and Singapore. Lin Qu's co-authors include Haitao Ma, Ning Zhao, Ying Wu, Anil Kunwar and Huijing Zhao and has published in prestigious journals such as Journal of Applied Physics, Macromolecules and Polymer
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