Luhua Xu
About
Luhua Xu has authored 27 papers that have received a total of 862 indexed citations.
This includes 17 papers in Electrical and Electronic Engineering, 10 papers in Electronic, Optical and Magnetic Materials and 9 papers in Mechanical Engineering. The topics of these papers are Electronic Packaging and Soldering Technologies (16 papers), 3D IC and TSV technologies (11 papers) and Copper Interconnects and Reliability (9 papers). Luhua Xu is often cited by papers focused on Electronic Packaging and Soldering Technologies (16 papers), 3D IC and TSV technologies (11 papers) and Copper Interconnects and Reliability (9 papers) and collaborates with scholars based in Singapore, China and United States. Luhua Xu's co-authors include J.H.L. Pang, Xiaodong Wu, K. N. Tu, Duan Weng and Jianmin Miao and has published in prestigious journals such as Applied Physics Letters, Journal of Applied Physics and Materials Science and Engineering A
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