Luu Nguyen
About
Luu Nguyen has authored 60 papers that have received a total of 1.2k indexed citations.
This includes 46 papers in Electrical and Electronic Engineering, 14 papers in Mechanics of Materials and 10 papers in Mechanical Engineering. The topics of these papers are Electronic Packaging and Soldering Technologies (37 papers), 3D IC and TSV technologies (21 papers) and Integrated Circuits and Semiconductor Failure Analysis (8 papers). Luu Nguyen is often cited by papers focused on Electronic Packaging and Soldering Technologies (37 papers), 3D IC and TSV technologies (21 papers) and Integrated Circuits and Semiconductor Failure Analysis (8 papers) and collaborates with scholars based in United States, Italy and France. Luu Nguyen's co-authors include D. Varghese, S. Krishnan, S.A. Gee, Susanna Reggiani and Ganesh Subbarayan and has published in prestigious journals such as Applied Physics Letters, Journal of Applied Physics and Acta Materialia
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