L.W. Schaper
About
L.W. Schaper has authored 29 papers that have received a total of 450 indexed citations.
This includes 22 papers in Electrical and Electronic Engineering, 8 papers in Electronic, Optical and Magnetic Materials and 6 papers in Biomedical Engineering. The topics of these papers are Semiconductor materials and devices (14 papers), 3D IC and TSV technologies (13 papers) and Copper Interconnects and Reliability (8 papers). L.W. Schaper is often cited by papers focused on Semiconductor materials and devices (14 papers), 3D IC and TSV technologies (13 papers) and Copper Interconnects and Reliability (8 papers) and collaborates with scholars based in United States. L.W. Schaper's co-authors include S. L. Burkett, Simon S. Ang, W.D. Brown, Qihua Xiong and Richard K. Ulrich and has published in prestigious journals such as Applied Physics Letters, Journal of Applied Physics and Proceedings of the IEEE
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