M. Assous

23 papers and 204 indexed citations i.

M. Assous has authored 23 papers that have received a total of 204 indexed citations. This includes 21 papers in Electrical and Electronic Engineering, 9 papers in Electronic, Optical and Magnetic Materials and 4 papers in Biomedical Engineering. The topics of these papers are 3D IC and TSV technologies (12 papers), Copper Interconnects and Reliability (9 papers) and Semiconductor materials and devices (8 papers). M. Assous is often cited by papers focused on 3D IC and TSV technologies (12 papers), Copper Interconnects and Reliability (9 papers) and Semiconductor materials and devices (8 papers) and collaborates with scholars based in France, Austria and India. M. Assous's co-authors include A. Farcy, L. Arnaud, V. Arnal, O. Louveau and M. Fayolle and has published in prestigious journals such as Applied Spectroscopy, Microelectronic Engineering and IEEE Transactions on Device and Materials Reliability