M. Bachman

15 papers and 204 indexed citations i.

M. Bachman has authored 15 papers that have received a total of 204 indexed citations. This includes 13 papers in Electrical and Electronic Engineering, 2 papers in Atomic and Molecular Physics, and Optics and 2 papers in Aerospace Engineering. The topics of these papers are 3D IC and TSV technologies (6 papers), Advanced MEMS and NEMS Technologies (5 papers) and Electronic Packaging and Soldering Technologies (4 papers). M. Bachman is often cited by papers focused on 3D IC and TSV technologies (6 papers), Advanced MEMS and NEMS Technologies (5 papers) and Electronic Packaging and Soldering Technologies (4 papers) and collaborates with scholars based in United States, France and South Korea. M. Bachman's co-authors include G.P. Li, Franco De Flaviis, Bedri A. Cetiner, Jiangyuan Qian and J.W. Osenbach and has published in prestigious journals such as The Journal of Physical Chemistry A, IEEE Transactions on Microwave Theory and Techniques and Journal of Lightwave Technology